Three P-Channel MOSFETs from the NCE 30P line, all rated at -30V, all aimed at high-side load and battery switching — but different dies, packages and philosophies: the 30P50G (surge-class 50A, DFN 5x6), the 30P30G (conduction-optimized 30A, DFN5×6-8L) and the 30P30K (light-gate 30A, TO-252-2L).
What separates them is not the sticker current. It is the test conditions behind the rows, the drive rail each die expects, and the heat path each package offers.
Here's the one-line guide: 10V rail and pulse loads → 50G; 4.5-10V and conduction loss → G; weak driver or TO-252 assembly → K. Above ~30A continuous, none of them — go N-ch plus a driver.
| Parameter | NCE30P30G | NCE30P30K | NCE30P50G |
|---|---|---|---|
| Datasheet rev | v1.0 | v1.0 | v2.0 |
| Package | DFN5×6-8L | TO-252-2L (DPAK) | DFN 5x6 EP |
| VDS / VGS | -30V / ±20V | -30V / ±20V | -30V / ±20V |
| ID @ 25°C | -30A | -30A | -50A |
| ID @ 100°C | not published | -21.2A | not published |
| IDM pulsed | -160A | -70A | -200A |
| RDS(on) max @ 10V | 10mΩ (tested -15A) | 18mΩ (tested -20A) | 7mΩ (tested -10A) |
| RDS(on) max @ 4.5V | 15mΩ (tested -10A) | 30mΩ (tested -15A) | no row (10V-only) |
| VGS(th) band | -1.0 to -2.2V | -1.2 to -2.5V | -1.0 to -2.2V |
| PD @ TC 25°C | 80W | 60W | 35W |
| RθJC | 1.56°C/W | 2.5°C/W | 3.6°C/W |
| Max TJ | 150°C | 175°C | 150°C |
| Qg total | 81.3nC | 31.2nC | 84nC |
| Ciss | 4222pF | 1363pF | 3590pF |
| Body diode IS | not published | -20A | -50A |
| Body diode VSD | -1.2V | -1.2V | -0.85V typ |
| Body diode trr | not published | 24ns | 45ns max |
| EAS (single pulse) | not published | 169mJ | 300mJ |
| 100% UIS / ΔVds tested | claimed (no number) | claimed (with number) | claimed (with number) |
The table says it in four rows: test current, 4.5V row, RθJC, and what gets published.
What's the real difference at your load current? That is where the comparison starts — none of the three rows is measured at its own sticker.
The K publishes the most rows per milliohm; the G publishes the best thermal row; the 50G publishes the biggest pulses and the biggest diode — with the tightest case envelope.
The 50G's 7mΩ is measured at -10A; the G's 10mΩ at -15A; the K's 18mΩ at -20A. None is measured at its sticker current.
At the same current the gaps narrow — and the honest comparison is at your load current, not at the datasheet's test points.
The G guarantees 15mΩ at 4.5V; the K guarantees 30mΩ at 4.5V; the 50G has no 4.5V row at all.
If 4.5-5V is your only drive, the 50G is out — and the G wins on loss. None of the three guarantees anything from 3.3V logic.
The biggest die (50G) publishes the tightest envelope: 35W behind RθJC 3.6°C/W. The 30A DFN (G) publishes 80W at 1.56; the TO-252 (K) 60W at 2.5.
Package attribution differs between datasheets, but the practical reading is the same: the 50G is built for surge duty, not for continuous 50A.
The K publishes the fullest set: EAS 169mJ, ID -21.2A at 100°C, trr 24ns, TJ 175°C.
The G publishes the best RθJC and a 4.5V row, but no EAS, no 100°C row, no diode recovery. The 50G publishes the biggest numbers — EAS 300mJ, IS -50A, IDM -200A — and claims high ESD without a rating row.
Motor stalls, hot-plug inrush, solenoid banks — IDM -200A and EAS 300mJ are the budget for events, not for averages. Its -50A body diode makes reverse-protection designs defensible.
Don't pick it for 4.5V drive (no row) or for continuous 40A+ on a board (17.5W against a 35W envelope).
The DFN5×6 pad with 2oz copper gives the family's best RθJC (1.56°C/W) and the 4.5V row is real (15mΩ max).
Don't pick it when you need a published avalanche budget, a 100°C current row, or a driver that cannot move 81.3nC.
31.2nC switches from a modest 10V source; the tab is inspectable and hand-solderable; EAS 169mJ, ID -21.2A at 100°C and trr 24ns are all published.
Don't pick it when the load sits at 20A+ continuous — 7.2W worst-case at 20A is the highest loss of the trio.
Below ~10-12A continuous, the SOP-8 steps (30P12S/15S/25S) carry the same jobs with the same drive logic — at lower cost per die.
Above ~30A continuous, no P-ch in this family is the right answer. An N-ch plus a high-side driver halves the conduction loss and stops being optional.
Biggest die, tightest envelope: the 50G's 35W case ceiling is a surge-duty statement. For continuous conduction loss on a real pad, the G's 1.56°C/W is the class leader; the K's tab trades envelope for assembly ease and drive budget.
A: The NCE30P30G, if the pad has copper — the 50G if the load stalls hard. At 20A the G loses 4.0W worst-case against the K's 7.2W, and it guarantees a 4.5V row as margin. If stall currents pass ~40A regularly, the 50G's -200A pulse budget is the insurance that pays for itself.
A: The G or the K — the 50G is out. The G guarantees 15mΩ max at 4.5V; the K 30mΩ. The 50G has no 4.5V row at all, so its 7mΩ is a 10V-only promise. And none of the three guarantees conduction from 3.3V — level-shift or measure.
A: Both datasheets describe a DFN5X6-8L package, but confirm the pin map from each figure. The G's datasheet (v1.0) and the 50G's (v2.0) both use the DFN5×6 leadless body. Same package family does not guarantee identical pin assignment across dies — verify against the respective figures before layout.
A: Datasheet attribution, and a design statement. The 50G lists RθJC 3.6°C/W with PD 35W at TJ 150°C; the G lists 1.56°C/W with 80W. Both are self-consistent. The practical reading is that the 50G is specced for surge duty, where junction temperature is set by pulse energy and duty, not by continuous watts.
A: All three, with a real driver — the K is the easiest. Qg is 31.2nC (K), 81.3nC (G), 84nC (50G). A push-pull stage or driver IC moves all three at tens of kilohertz. The difference shows in weak drives: the K switches where the DFN dies simmer. A pull-up-only gate is wrong for all three above a few kilohertz.
A: Only if the layout is a 50A layout and the drive is 10V. Same leadless package family, but the pin map must be confirmed and the pad-to-pour copper must be sized for the higher current. The drive rail also decides it — on a 4.5V board the 50G is not an upgrade, it is a non-starter.
A: The 50G — that is its job. Stall current on a stalled brushed motor can reach many times the running current. The 50G's IDM -200A and EAS 300mJ are the pulse budget for that event; the G (-160A, no EAS row) and the K (-70A, 169mJ) are smaller answers to the same question.
A: The 50G if the main path is heavy; the K if the load is modest. Both publish body-diode ratings (IS -50A at -0.85V typ for the 50G, -20A for the K); the G publishes no diode row at all. For back-to-back P-ch blocking without an external Schottky, the published diode row is the spec you design against.
A: Yes, with a gate clamp — the ±20V VGS is the limit, not the -30V VDS. Turning on pulls the gate to ground, so on-state VGS on a 24V rail is about -24V against the ±20V max. Add an 18V zener between gate and source, or keep the rail at or below ~18V. At 24V the drain margin (24V vs -30V) also wants a TVS for switching spikes.





