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The NCE30H10K is a 30V, 100A N-Channel power MOSFET from Wuxi NCE Power in TO-252 (DPAK). RDS(on) is 5.5mΩ max @ 10V - the part that carries current when the load switch and logic-level parts can't.
From our Shenzhen distribution work (2025–2026), the 30H10K sits in a specific socket: motor drives, BMS discharge paths, and inverter stages where the current is real and the gate comes from a proper driver.
The spec that matters most is the combination - 100A rating means I²R loss is 55W at full current. The datasheet number is only true on a well-thermalized board.
| Parameter | Value |
|---|---|
| Type | N-Channel Enhancement Mode Power MOSFET (Trench) |
| Package | TO-252-2L (DPAK), surface mount |
| Drain-Source Voltage (VDS) | 30V |
| Gate-Source Voltage (VGS) | ±20V |
| Continuous Drain Current (ID) | 100A @ 25°C (package- and board-limited) |
| On-Resistance RDS(on) @ 10V | 5.5mΩ max (typ 4mΩ) |
| On-Resistance RDS(on) @ 4.5V | 8mΩ typ |
| Gate Threshold Voltage (VGS(th)) | 3V typ (per NCE datasheet) |
| Max Power Dissipation (PD) | 110W @ 25°C (case temperature) |
| Total Gate Charge (Qg) | 70nC @ 4.5V |
| Input Capacitance (Ciss) | 3.4nF |
| Output Capacitance (Coss) | 356pF |
| Operating Junction Temperature | -55°C to +175°C |
Key numbers that matter: do the loss math before you trust the 100A rating. At 50A, I²R = 13.75W; at 100A it's 55W. The 110W PD rating assumes the case stays cool - on a bare TO-252 pad you're nowhere near that.
The gate side is a driver's part, not an MCU's: VGS(th) typ 3V and 70nC gate charge mean a GPIO through a resistor will hold the die in the linear region and roast it. Budget a gate driver and low-impedance drive at 10V.
Per the NCE30H10K datasheet, the 4.5V drive figure exists, but this is a 10V-driven device in practice - the 5.5mΩ max rating is at VGS = 10V.
✅ Use NCE30H10K when:
❌ Don't use NCE30H10K when:
| Model | Type | Key Difference | Best For |
|---|---|---|---|
| NCE30H10K-VB | N-Ch, TO-252 | 2mΩ @ 10V, Vth ~1.9V | Lower-loss cross-reference; verify against official datasheet |
| NCE9926 | Dual N-Ch, SOP-8 | 20V/6A, 2.5V logic drive | Low-current logic-driven switching and battery protection |
| NCE9435 | Single P-Ch, SOP-8 | -30V/-5.1A, 4.5V drive | High-side load switching without a gate driver |
| IRLR2905-family | N-Ch, TO-252 | 55V/42A, logic-level | Higher voltage, logic-level TO-252 sockets |
| NCE40H12K | N-Ch, TO-252 | 40V-class, higher voltage headroom | 24V systems with margin for motor flyback |
The power-stage decision in one line: 30H10K when the current is real (10A+) and a driver exists; NCE9926 when logic drives directly; NCE9435 when the switch is high-side and simple.
TO-252 (DPAK) pinout: pin 1 Gate, pin 2 Drain, pin 3 Source, tab = Drain - the standard N-Channel TO-252 arrangement. The tab is the thermal path: it's electrically Drain and must be soldered to a copper pour.
Low-side motor drive: the 30H10K switches the motor's return path to GND; a gate driver delivers 10V with 2–4A peak to charge the 70nC gate. The freewheel diode across the motor clamps flyback when the FET opens. Dead time is mandatory when two such stages form an H-bridge.
RDS(on) across the NCE power line - conduction loss at 10A:
At 10A, the 30H10K dissipates 0.55W - a tenth of the 9435's 5.3W in the same job. The TO-252's tab and copper pour are what make the difference.
DC motor H-bridge (12V/24V): Four NCE30H10Ks form a classic N-Channel H-bridge with a driver IC. At 30A per FET the conduction loss is 5W each - the TO-252 tab pours and driver dead-time control are what keep the bridge alive through locked-rotor peaks.
BMS high-current discharge path: In a 1–7S pack discharge stage, the 30H10K replaces multiple paralleled small FETs. One 100A-rated die with proper copper replaces three or four 30A parts and their gate drivers.
Low-voltage inverter stage: The datasheet lists UPS and inverters. At tens of kHz, the 70nC gate charge needs a driver with a few amps of peak current, and the low RDS(on) keeps the switching-stage conduction loss small.
Battery tool and e-bike power stages: High-current interrupted flows - throttle, brake, and boost paths. The avalanche rating absorbs the motor's flyback without an external clamp diode in many designs.
Lot-tested for the ratings that burn. We verify RDS(on) at 10V and VGS(th) on every lot before shipping. At 100A class, a remarked die with 2× the resistance fails exactly where it hurts - heat.
Cross-reference support for the whole NCE power line. Not sure whether your stage wants the 30H10K, the 40H-class, or a paralleled SOP-8 pair? Send us the rail voltage, peak current, and switching frequency - we'll match the die.
BOM consolidation for power products. The same motor-drive BOM carries the 30H10K power stage, the NCE9926 logic switch, and the NCE9435 high-side rail. One shipment covers the entire FET population.
Same-day dispatch, 5–10 days worldwide. Orders before 15:00 CST ship same day via DHL or FedEx.
A: Only under datasheet conditions - cool case, low ambient. The 100A figure assumes the case is held at 25°C. In the real world, I²R at 100A is 55W, so the package and PCB thermal path decide what you actually get. Budget 30–60A continuous on a well-thermalized board, with 100A as a peak capability.
A: No - and this is the most common way to kill it. With VGS(th) typ 3V and 70nC gate charge, a GPIO holds the die in the linear region during switching, dumping power into the FET instead of the load. Use a gate driver (peak current of 2–4A is typical for this Qg) at 10V drive.
A: 10Ω is the typical starting point; 5Ω for fast switching. Too large a resistor forms an RC with the 3.4nF input capacitance and keeps the FET in the ohmic region too long - excess heat. Too small invites ringing and gate-oxide stress. For paralleled FETs, each die gets its own gate resistor.
A: Yes, but each FET needs its own gate resistor. Thresholds differ between dies; without individual resistors, the lower-threshold FET grabs the current and dies first. With separate gate resistors, parallel devices share reasonably well. The TO-252 tab pours still need to be symmetric for thermal sharing.
A: Standard copper foil won't carry it - plan a copper bar or heavy pours. Roughly 15mm² of copper cross-section is the rule of thumb for 100A. On a typical 2oz (70µm) layer, that's a 215mm-wide trace - in practice, solder copper bars or bus bars over the FET tabs.
A: 30H10K for the power path, 9926 for logic-driven switching, 9435 for high-side. The 30H10K carries 10–100A with a real driver; the NCE9926's 2.5V-specified channels handle 2–4A from GPIOs; the NCE9435 does high-side P-Channel without a level shifter. Most boards need two of the three.
A: Check three things: dead time, gate drive, and layout inductance. At 100A, shoot-through (both FETs on) vaporizes dies in microseconds - dead time is mandatory. Undervoltage on the driver leaves FETs half-on, another classic killer. And source-lead inductance induces voltages that can spike the gate oxide - keep the driver low-impedance and the layout tight.
A: I²R first, then the thermal budget. At 40A, loss is 8.8W (40² × 5.5mΩ). The TO-252 junction-to-case is low, but junction-to-ambient on bare copper is terrible - size the pour or heatsink so junction stays under ~125°C (with 175°C max, keep 50°C margin).
A: Inrush into the output capacitance or motor is exceeding the safe area. A discharged capacitor bank looks like a short - 100A-capable die will charge it violently. Add soft-start (slower gate edge or an inrush limiter) and check the SOA during the transient, not just steady state.
A: The -VB is a VBsemi-sourced cross-reference with a lower-loss die: about 2mΩ @ 10V and Vth ~1.9V. Functionally compatible in the TO-252 socket, but the lower threshold changes drive requirements - verify against the specific datasheet before you swap it into a design tuned for the NCE original.
| Image |
|
| Part Number | NCE30H10K |
| Manufacturer | NCEPower |
| Series | |
| Package/Case | |
| Packaging | TO-252 |
| Product Status | Production |
| FET Type | Industrial grade |
| Technology | Trench |
| Drain to Source Voltage (Vdss) | N |
| Current - Continuous Drain (Id) @ 25°C | 30 |
| Drive Voltage (Max Rds On, Min Rds On) | 100 |
| Rds On (Max) @ Id, Vgs | 1.6 |
| Vgs(th) (Max) @ Id | 4 |
| Gate Charge (Qg) (Max) @ Vgs | 5.5 |
| Vgs (Max) | 5 |
| Input Capacitance (Ciss) (Max) @ Vds | 8 |
| FET Feature | |
| Power Dissipation (Max) | |
| Operating Temperature | ±20 |
| Grade | 3400 |
| Qualification | 70 |
| Mounting Type | 110 |
| Supplier Device Package |
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