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Q: Is MURA220T3G a direct drop-in replacement for MURS220T3G?

Electrically yes, mechanically no. Same silicon, same specs. But the SMA package is narrower (2.92mm vs 3.56mm). Pads don't align. For new layouts wanting smaller footprint, use MURA220T3G. For existing SMB layouts, stick with MURS220T3G.

Q: Can I replace MURS220T3G with a Schottky?

Yes, if your rail is under ~65V. An MBRS3100T3G gives lower VF and zero recovery. But 100V vs 200V means less headroom, and 5mA leakage at 125°C may cause thermal issues. For sub-48V forward-biased apps, Schottky is an upgrade. Above 65V or in bridges, keep the ultrafast.

Q: What's the difference between MURS220T3 and MURS220T3G?

The 'G' suffix means Pb-free, halogen-free, RoHS compliant. MURS220T3 is obsolete (non-RoHS). MURS220T3G is the active replacement. Electrically identical. Always use the -G version for new designs.

Q: Which alternative has the lowest thermal resistance?

MURS320T3G (SMC) with RθJL under 10°C/W - nearly 25% better than MURS220's 13°C/W and less than half of MURA220's 24°C/W. For thermally stressed designs, the bigger SMC package pays for itself in reliability.

Q: Are there any through-hole equivalents?

MUR220 (DO-15/DO-201AD) is the through-hole version with same 200V/2A/35ns specs. Useful for prototyping, repair, or non-SMD designs. MURS220T3G is the surface-mount equivalent - same silicon, different package.

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MURS220T3G Equivalent, Alternative & Replacement Guide

2026/8/6 16:00:35

MURS220T3G Equivalent, Alternative & Replacement Guide | ICMASS

The MURS220T3G is ON Semi's 200V/2A ultrafast rectifier in SMB. It's active — you're not replacing an obsolete part. But you might want an alternative: smaller footprint (SMA), more current (3A), faster recovery, or second-source. Same function, different trade-off.

Here are the three best alternatives, compared head-to-head with the original — and when each makes sense.

MURS220T3G vs MURA220T3G vs MURS320T3G: Full Comparison

Parameter	MURS220T3G (Original)	MURA220T3G	MURS320T3G
Type	Ultrafast, SMB	Ultrafast, SMA	Ultrafast, SMC
Voltage (V_RRM)	200V	200V	200V
Current (I_O)	2A	2A	3A
V_F @ Rated I	0.95V @ 2A	0.95V @ 2A	0.95V @ 3A
t_rr	35ns	35ns	75ns
R_θJL	13°C/W	24°C/W	<10°C/W
Package (mm)	SMB 4.32×3.56	SMA 4.57×2.92	SMC 6.86×5.84
Best For	Balanced thermals & size	Space-constrained, <1.5A	Higher current, best thermals

R_θJL — lower is cooler

MURS320 (SMC)<10°C/W

MURS220 (SMB)13°C/W

MURA220 (SMA)24°C/W

When to Use MURA220T3G (SMA)

Same silicon: 200V/2A/35ns. But SMA gives R_θJL=24°C/W — nearly double SMB's 13. Use when board space binds and load <1.5A. Below 1A open-air, the thermal penalty doesn't matter. But how? SMA and SMB footprints differ by ~0.64mm width. Check your layout.

When to Use MURS320T3G (SMC, 3A)

Step up to MURS320T3G: 3A, SMC, R_θJL<10°C/W. But t_rr jumps 35→75ns. Below 100kHz at 2.5–3A, current headroom beats the speed penalty. Above 150kHz, recovery loss adds up. SMC body is ~7mm — check your board outline.

When NOT to Use Either — Go Schottky Instead

Rail under 48V? Skip ultrafast entirely. MBRS3100T3G (100V/3A Schottky) gives 0.79V V_F and zero recovery — half the conduction loss, no switching loss. The catch: 5mA leakage at 125°C, 100V limit. If your design lives within those constraints, Schottky beats ultrafast on efficiency. But why? Physics, not opinion.

Pinout & Layout Notes

t_rr — lower is faster switching

MURS220/MURA22035ns

MURS32075ns

All three: 2-pin, cathode-banded, J-bend SMD. Pin 1=Cathode, Pin 2=Anode. Cathode pad carries most heat — expand into copper pour. Layout fits SMC? Solder any of them onto SMC pads for free cooling. SMA on SMC pads looks odd but works fine electrically.

Other Alternatives Worth Knowing

ES2B-13-F (Diodes Inc.): 200V/2A, 20ns t_rr, 0.92V V_F, SMA. Faster recovery than MURS220, but smaller SMA package means less thermal mass. Best for second-source where speed matters more than thermals.
VS-2EJH02-M3 (Vishay FRED Pt): 200V/2A, 25ns t_rr, 0.93V V_F, SlimSMA. Performance upgrade path, but SlimSMA footprint is different — not a drop-in. Worth the layout change if you need 10ns faster recovery.
SURS8220T3G (ON Semi AEC-Q101): Same silicon and SMB package as MURS220T3G, with full automotive PPAP documentation. Use for production automotive programs where paperwork matters.
MBRS3100T3G (ON Semi Schottky): Different technology entirely. 100V/3A, 0.79V V_F, zero t_rr. If your rail is under 48V, this is the efficiency upgrade path.

Frequently Asked Questions

Q1: Is MURA220T3G a direct drop-in replacement for MURS220T3G?

A: Electrically yes, mechanically no. Same silicon, same specs. But the SMA package is narrower (2.92mm vs SMB's 3.56mm). The pads don't align. You need a PCB change. If you're starting a new layout and want the smaller footprint, use MURA220T3G. If you're replacing on an existing SMB layout, stick with MURS220T3G or its AEC-Q SURS8220 variant.

Q2: Can I replace MURS220T3G with a Schottky?

A: Yes, if your rail is under ~65V. An MBRS3100T3G gives lower V_F and zero recovery. But the 100V rating vs 200V means less headroom, and 5mA leakage at 125°C may cause thermal issues in reverse-biased configurations. For sub-48V forward-biased applications, the Schottky is an upgrade. Above 65V or in bridge rectifiers, keep the ultrafast.

Q3: What's the difference between MURS220T3 and MURS220T3G?

A: The "G" suffix = Pb-free, halogen-free, RoHS. MURS220T3 is obsolete (non-RoHS). MURS220T3G is the active replacement. Electrically identical. Always use the -G version for new designs.

Q4: Which alternative has the lowest thermal resistance?

A: MURS320T3G (SMC), with R_θJL under 10°C/W. Nearly 25% better than MURS220's 13°C/W, and less than half of MURA220's 24°C/W. If your design runs hot, the bigger SMC package pays for itself in reliability. But it's 6.86mm long — check your board outline before committing.

Q5: Are there any through-hole equivalents?

A: MUR220 (DO-15/DO-201AD) is the through-hole version. Same 200V/2A/35ns ultrafast specs. Useful for prototyping, power supply repair, or designs where surface-mount isn't feasible. But if you're converting from through-hole to SMD, the MURS220T3G is the surface-mount equivalent. Same silicon, different package.