The answer, fast: above roughly 20–30A at 650V and below roughly 20–50kHz, an IGBT beats a MOSFET; below that current or above that frequency, the MOSFET wins. Everything else is detail — but the detail decides.
From what we see across Shenzhen lots (2025–2026), the pattern on the bench is remarkably consistent: IGBTs go into motor drives, inverters, and welding supplies; MOSFETs go into every power supply.
When we ask why, the answer is rarely "because the datasheet said so" — it's because the load was either high-current/low-frequency or low-current/high-frequency. The physics of the two devices follows that split exactly.
Start with the loss equations, because everything else follows from them. A MOSFET conducts like a resistor: Pcond = I² × RDS(on). An IGBT conducts like a voltage source: Pcond = VCE(sat) × I. One is quadratic, the other linear — and quadratic always loses at high current.
Work a real example at 650V class. A 40A MOSFET at 80mΩ burns 40² × 0.08 = 128W conducting. A 40A IGBT at 1.45V burns 40 × 1.45 = 58W. Same current, half the heat.
That's the entire argument for IGBTs above the crossover — and it's why every motor-drive inverter on the market runs IGBTs.
Now drop to 5A. The same MOSFET burns 2W; the same IGBT still burns 7.25W because its 1.45V floor doesn't shrink with current. Below the crossover, the millivolt-level drop of a good MOSFET beats any VCE(sat), no matter how the datasheet is spun.
Where exactly does the flip happen? For 600V silicon devices, around 20–30A at 25°C — and the number slides down as temperature rises.
RDS(on) roughly doubles from 25°C to 150°C while VCE(sat) drifts only modestly. A design that crosses at 25A on paper can cross at 15A in a 90°C enclosure.
| Load current at 650V | Conduction winner | Why |
|---|---|---|
| <10A | MOSFET | Millivolt drop vs 1.2–3.5V floor |
| 10–20A | Borderline | Moves with temperature and frequency |
| 20–30A+ | IGBT | Linear VCE(sat) beats quadratic I²R |
Conduction loss at 40A, 650V class — the whole crossover argument in two bars:
Same 40A, half the conduction heat. Flip the numbers to 5A and the bars reverse — 2W vs 7.25W. The crossover is where those two bars cross.
Conduction is only half the story. The IGBT's low drop comes from minority-carrier injection — and those injected carriers must recombine before the device turns off.
That recombination shows up as a tail current: the collector keeps conducting for a slice of time after the gate signal ends, burning switching energy every cycle.
A MOSFET, unipolar, has no stored charge to sweep out. It turns off clean in tens of nanoseconds. That difference sets the frequency ceiling: IGBTs are efficient only below roughly 20–50kHz, while superjunction MOSFETs switch clean well past 100kHz.
Motor drives run at 1–20kHz. Welding machines, a few kHz. UPS systems, 10–20kHz. All of them are conduction-dominated, low-frequency, high-current — textbook IGBT territory, and exactly what the Shenzhen boards confirm. High-frequency PFC stages, resonant converters, and fast chargers run 100kHz+, which is MOSFET territory, period.
| Application | Typical frequency | Typical current | Winner |
|---|---|---|---|
| Motor drive / inverter | 1–20kHz | 10–200A | IGBT |
| Welding supply | 2–20kHz | 20–100A | IGBT |
| UPS / industrial inverter | 10–20kHz | 10–100A | IGBT |
| PFC stage | 65–130kHz | 1–10A | MOSFET |
| Flyback / SMPS | 65–200kHz | 1–15A | MOSFET |
| Fast charger (high power) | 50–100kHz | 20A+ | SiC or IGBT, case by case |
A MOSFET's body diode conducts reverse current for free. An IGBT has no built-in reverse path at all.
Every bridge circuit running IGBTs needs an antiparallel diode per device, or the freewheeling current has nowhere to go. That's extra parts, extra layout, and a failure mode that never appears in a MOSFET design.
IGBTs typically withstand a short circuit for 5–10µs; MOSFETs need protection in microseconds. In an industrial drive with contactor bounce or a stalled motor, that extra time is the difference between a protection trip and a burned module — a big reason fault-tolerant industrial designs favor IGBTs.
IGBTs hate linear operation — small dies, poor current sharing, thermal runaway. Electronic loads and soft-start stages need MOSFETs designed for linear work. The dummy-load threads on EEVblog steer everyone the same way: don't build a linear load out of IGBTs.
Modern superjunction MOSFETs (CoolMOS, MDmesh class) made 650V a genuine contest, not a walkover. They switch fast, conduct well at moderate current, and come with the body diode built in.
At 650V with 5–10A and 100kHz, a superjunction MOSFET beats any IGBT on total loss — which is why PFC stages and flyback supplies at 650V are MOSFET country.
There's also the voltage-scaling physics: silicon MOSFET on-resistance rises roughly with V2.5, which is why 100V MOSFETs are cheap and 1200V MOSFETs are impractical.
At 650V the superjunction technology keeps RDS(on) manageable. Push to 1200V and the die area explodes — 1200V-class designs are IGBT (or SiC) territory by default.
Question 1: What's the average current? Below ~20A, the MOSFET's millivolt drop wins. Above ~30A, the IGBT's flat VCE(sat) wins. In between, the next three questions decide.
Question 2: What's the switching frequency? Under ~20kHz, conduction dominates and the IGBT looks good. Above ~50kHz, the tail current makes the IGBT a loser and the MOSFET's clean switching wins.
Question 3: Is there reverse-current conduction? Half-bridges, synchronous rectifiers, and motor commutation all push current backward through the switch. The MOSFET's body diode handles it for free; the IGBT needs an antiparallel diode per device — count the cost and the layout space.
Question 4: How hot will the junction actually run? Evaluate at the worst-case temperature, not 25°C. RDS(on) doubles by 150°C, dragging the crossover down; a board that "passes at 25A on paper" can flip to IGBT territory in a sealed enclosure.
The one-line verdict: high current + low frequency + hot environment → IGBT. Low to moderate current + high frequency + tight space → MOSFET. At 650V, both are legitimate — the math at your operating point decides, not the marketing.
Four-question decision tree: current decides the coarse path, frequency and temperature the fine one. In the 10–30A middle zone, run the total-loss math at your worst-case junction temperature before committing — the 25°C datasheet numbers will lie to you.
A: It's the contested zone — below ~500V MOSFETs dominate, above ~650V IGBTs take over, and in between the current and frequency decide. Superjunction MOSFETs made 650V viable for moderate current; 1200V-class designs are IGBT or SiC territory because silicon MOSFET resistance rises with the 2.5th power of voltage.
A: Only at low power — a 650V MOSFET with enough current rating is expensive and the switching frequency doesn't help at 5kHz anyway. At motor-drive currents (10A+), the IGBT's flat VCE(sat) wins on conduction loss, and the drive frequency never needs the MOSFET's speed.
A: The bipolar structure doesn't create one — the P-N collector junction blocks reverse current. Bridge circuits must add antiparallel diodes per device. This is a real BOM and layout cost that never appears in MOSFET designs.
A: It costs switching energy every cycle — typically 5–10× the per-cycle switching loss of a comparable MOSFET. At 10kHz that's tolerable; at 100kHz it dominates the loss budget and the IGBT becomes inefficient. It's the physical reason IGBTs stop at ~50kHz.
A: Not always — but bridge designs in noisy environments benefit from a −5V to −15V off bias to stop parasitic turn-on. EEVblog and Infineon discussions trace the false turn-on to Miller-capacitance coupling (dv/dt) and stray emitter inductance (di/dt); a negative bias keeps the gate below threshold through those spikes.
Modern trench field-stop IGBTs run fine with 0V off in benign appliance drives — the negative rail is a robustness measure for industrial noise, not a universal requirement. Miller clamps help with dv/dt but not di/dt, which is where the negative bias earns its keep.
A: IGBTs win on short-circuit withstand (5–10µs) but lose on linear-region operation. For fault-prone industrial environments the IGBT's wider protection window matters; for electronic loads and linear stages, MOSFETs are the only safe choice.





