ESD200B1CSP0201XTSA1.pdf
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ESD200B1CSP0201XTSA1.pdf
The ESD200-B1-CSP0201 is a low-capacitance bi-directional ESD protection diode from Infineon in a 0.58 × 0.28mm CSP0201 package — one protected line, ±5.5V working voltage, 6.5pF capacitance, and a 13V clamp at 16A.
From what we see across Shenzhen module shipments (2025–2026), 0201-class ESD diodes ride on nearly every keypad, audio, and I2C line in consumer hardware. The field mistake we see most: putting a high-capacitance power TVS on a signal line, then chasing signal-integrity problems the protector itself caused.
6.5pF is the whole point. Small enough for low-speed signal lines, with a ±19kV ESD rating on top.
| Parameter | Value |
|---|---|
| Type | Bi-directional TVS / ESD protection diode, 1 protected line |
| Reverse Working Voltage (VRWM) | ±5.5V max |
| Breakdown Voltage | 6V min / 10V max |
| Line Capacitance (CL) | 6.5pF typ @ 1MHz |
| Dynamic Resistance (RDYN) | 0.2Ω typ |
| Clamping Voltage (VCL) | 13V typ @ ITLP = 16A |
| Reverse Leakage (IR) | <1nA typ (100nA max) |
| Peak Pulse Current (IPP) | ±3A (8/20µs); peak pulse power 37.5W |
| ESD Rating (IEC61000-4-2) | ±19kV air / ±17kV contact |
| EFT Rating (IEC61000-4-4) | ±2kV / ±40A (5/50ns) |
| Package | WLL-2-1 (CSP0201), bottom terminals, marking "A" |
| Dimensions | 0.58 × 0.28 × 0.15 mm; 15,000 per reel |
| Operating Temperature | −55°C to +125°C |
Key numbers that matter: the 6.5pF is the selection driver — per the Infineon datasheet it keeps signal lines clean while still clamping at 13V with sub-nanoamp leakage. The ±19kV air discharge rating exceeds the IEC61000-4-2 class-4 requirement (15kV) with headroom to spare.
✅ Use ESD200-B1-CSP0201 when:
❌ Don't use ESD200-B1-CSP0201 when:
| Model | Type | Key Difference | Best For |
|---|---|---|---|
| ESD5V3U2U-03 | Bi-directional ESD diode | SOD-323, similar rating, bigger package | Hand-solderable builds, same protection class |
| USBLC6-2SC6 | ESD array (2 lines + rail) | SOT-23-6, protects two lines with rail clamp | USB 2.0 and dual-line interfaces |
| ESD9L5.0 | Unidirectional ESD diode | SOD-923, 5V working, single polarity | Single-polarity 5V rails and GPIO |
| SMAJ5.0A | Power TVS | 400W surge class, high capacitance | Rail and input surge protection |
| Steering diode array | Discrete + rail TVS | Lower capacitance, but latch-up and overshoot risk | Legacy designs, signal speeds the ESD200 can't reach |
The decision in one line: capacitance first — slow lines and tiny boards → ESD200; dual-line → USBLC6-class array; surge energy → power TVS.
But why does capacitance beat raw protection power? Because a protector that distorts the signal fails on every transaction, while an ESD strike is rare — forum threads on "bigger is safer" TVS failures all trace back to skipping this first step.
CSP0201 outline: a 0.58 × 0.28mm body with both terminals on the bottom face — no leads, no side pins. The "A" marking corner is the only orientation cue, and the pads sit directly under the body, so the part self-aligns in reflow.
Protection hookup: the diode shunts across the signal line to ground — normal data passes untouched, an ESD strike takes the 0.2Ω dynamic resistance path instead of the IC pin.
Place it as close to the connector as the board allows; every millimeter of trace before the diode adds inductance the clamp must overcome.
Line capacitance per interface — lower is better for speed:
6.5pF is fine below a few MHz and fatal at 10Gbps — that's the "bigger is safer" trap. What does that look like in practice?
A high-power TVS on a USB 3.2 pair rolls off the high-frequency content and closes the eye diagram — trading a rare ESD event for a guaranteed signal-integrity failure.
Keypad and button interfaces: one diode per row or column line, sized to fit the 0.3mm pitch these boards run. The 6.5pF load is irrelevant at key-scan speeds, and the ±19kV rating survives the human body model events that wreck unprotected scans.
I2C and GPIO buses in modules: WiFi modules, fingerprint sensors, and flash cards expose their lines at a connector edge — exactly where ESD arrives. A single CSP0201 per exposed line adds 6.5pF to a bus that tolerates tens of pF, and the sub-nanoamp leakage keeps the module's sleep budget intact.
Audio and headset lines: bi-directional clamping matters here — audio signals swing both polarities, and a unidirectional part would conduct on normal operation. The symmetric IV curve protects the codec input without loading the line the way a steering-diode array can.
Battery and wearable PCBs: at 0.58 × 0.28mm the diode fits where a SOD-323 won't — next to a micro-connector on a flex, inside a earbud stem, on a watch mainboard. It's the smallest protection that still carries a full IEC61000-4-2 rating.
Capacitance and breakdown verified on incoming lots. We sample CL at 1MHz and VBR before shipment — a relabeled or wrong-grade ESD part shows up on the breakdown measurement, and mixed-reel leakage is the classic failure in this package class.
Cross-reference support for the whole ESD family. Not sure whether your line needs 6.5pF, a 2-line array, or a surge-class TVS? Send the interface speed, signal swing, and connector — we'll tell you which device the line actually needs, and keep the capacitance math straight.
BOM consolidation for module builders. The same board usually carries the MCU, a flash (W25Q-class), and ESD200 on the exposed lines — one shipment from Shenzhen covers the whole protection and storage section.
Same-day dispatch, 5–10 days worldwide. Orders before 15:00 CST ship same day via DHL or FedEx. For volume orders, we source directly from the Infineon production line.
A: When the signal swings both polarities. Audio lines, differential pairs, and any line that goes below ground in normal operation need a symmetric clamp. A unidirectional part conducts on the negative half of the swing and corrupts the signal — the Infineon community guidance is simply: single polarity → unidirectional, both polarities → bi-directional.
A: Capacitance — bigger protection means bigger junction area. A power TVS that handles surges carries tens of pF and rolls off high-frequency content. An Arduino forum thread on low-capacitance ESD diodes makes the tradeoff explicit, and high-speed interface budgets are unforgiving: USB 3.2 pairs need ≤0.5pF, HDMI 2.1 needs ≤0.25pF. "Bigger is safer" closes the eye diagram before the first ESD event ever happens.
A: Breakdown is where conduction starts; clamping is what the IC actually sees. This part breaks down at 6–10V and clamps at 13V typ at 16A. During a real ESD pulse the clamped voltage can overshoot well above the spec — a StackExchange analysis notes high-current events can push a TVS to roughly 3× its rated clamp — so the margin between clamp and the IC's absolute maximum is what really decides survival.
A: Everything below a few MHz. Keypads, GPIO, I2C, audio, touch, and slow sensor lines tolerate 6.5pF without measurable effect — the general rule from the Infineon community is that low-speed applications tolerate higher capacitance, while high-speed lines cannot.
A: In precision or battery circuits, yes — and this part is built for that. Sub-nanoamp typ (100nA max) leakage keeps analog front-ends and coin-cell designs honest. An EEVblog thread on ADC input protection warns that ordinary clamp diodes leak "like a sieve" at 50°C and wreck precision measurements — the ESD200's leakage spec is the reason it belongs in those circuits.
A: Simpler, more robust for a single line. Steering-diode arrays dump surge current into the power rail, which risks latch-up and needs an oversized decoupling cap; discrete steering diodes also aren't rated for ESD transient currents. A dedicated TVS per line clamps to ground, disturbs nothing else, and avoids the rail-dumping failure mode entirely — EEVblog threads recommend it whenever the signal level differs from the supplies.
A: As close to the connector as possible. Every millimeter of trace between the connector and the diode adds inductance the clamp must overcome, which shows up as overshoot during the pulse. The ideal placement is directly at the connector pin or within a few mm of it — and the CSP0201's tiny footprint is what makes that placement practical.
A: They're the IEC61000-4-2 test levels the part survived. This part holds ±19kV air discharge and ±17kV contact discharge — above the class-4 level of 15kV that most product standards require. The rating tells you the diode survived; the clamp voltage tells you whether the IC behind it survived.
A: Reflow only — the terminals are on the bottom face. The 0.58 × 0.28mm body with bottom pads is not hand-solderable in practice; it needs a stencil, solder paste, and a reflow profile. The "A" marking corner is the orientation cue. For prototype or hand-assembly work, pick the SOD-323 alternative instead.
A: Above the highest normal signal voltage on the line. A 3.3V logic line fits a ±5.5V part comfortably. But a USB-C VBUS that negotiates 20V under Power Delivery needs a TVS with a working voltage above 20V — otherwise the protector conducts during normal operation and kills the line it was meant to save.
| Image |
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| Part Number | ESD200B1CSP0201XTSA1 |
| Manufacturer | Infineon Technologies |
| Package/Case | 2-SMD, No Lead |
| Series | - |
| Packaging | Tape & Reel (TR) |
| Product Status | Active |
| Type | Zener |
| Unidirectional Channels | - |
| Bidirectional Channels | 1 |
| Voltage - Reverse Standoff (Typ) | 5.5V (Max) |
| Voltage - Breakdown (Min) | 6V |
| Voltage - Clamping (Max) @ Ipp | 13V (Typ) |
| Current - Peak Pulse (10/1000µs) | 16A (8/20µs) |
| Power - Peak Pulse | - |
| Power Line Protection | No |
| Applications | General Purpose |
| Capacitance @ Frequency | 6.5pF @ 1MHz |
| Operating Temperature | -40°C ~ 125°C (TJ) |
| Grade | - |
| Qualification | - |
| Mounting Type | Surface Mount |
| Supplier Device Package | - |
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